10多家大陆IC设计公司向台积电下28nm芯片订单

sherwin

10多家大陆IC设计公司向台积电下28nm芯片订单

　　8月5日消息，据台湾电子时报报道，来自业内的消息，超过10家IC设计和IC设计服务公司已在台积电下了28nm芯片订单，表明大陆IC供应商竞争力日益增强。
　　该消息称，这些向台积电下28nm芯片订单的中国IC设计公司包括海思半导体、展讯通信、瑞芯微电子、全志科技、锐迪科及大唐。
　　此前，大陆IC设计公司主要依赖中芯国际和和舰科技代工低成本产品芯片用于国内市场。
　　该消息补充说，大陆IC设计公司已经开始引进先进工艺来提升他们芯片的性能，用于移动设备、电信设备、4G智能手机、物联网设备和其他有商机的应用中。
　　除了联发科的订单，大陆IC设计公司在台积电的订单量已超过了台湾本土IC厂商。（元器件交易网刘光明 译）
　　外媒原文如下：
　　China-based IC design houses ramping 28nm chip orders at TSMC
　　More than 10 China-based IC design houses and IC design service companies have placed 28nm chip orders at Taiwan Semiconductor Manufacturing Company (TSMC), indicating the strengthening competitiveness of China-based IC suppliers, according to industry sources.
　　China-based IC design houses that have tapped TSMC for 28nm foundry capacity include HiSilicon Technologies, Spreadtrum Communications, Rockchip Electronics, Allwinner Technology and RDA Microelectronics and Datang
　　Previously, China-based IC design houses mostly relied on Semiconductor Manufacturing International Corporation (SMIC) and Hejian Technology for low-cost foundry production in order to roll out chips for use in the domestic market, the sources noted.
　　China-based IC design houses have now begun adopting more advanced processes to enhance the performance of their chips for use in mobile devices, telecom equipment, 4G smartphones, IoT devices and other niche market applications, added the sources.
　　Excluding the wafer orders placed by MediaTek at TSMC, the total amount of wafer orders placed by China-based IC design houses at TSMC has actually exceeded that placed by Taiwan-based IC vendors, pointed out the sources.

阿伟

竞争很大，产能是个问题