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高速电路PCB网，专注于嵌入式方案，信号完整性和电源完整性仿真分析，高速电路PCB设计,各种EDA工具（Cadence\Mentor\\AD\\CAM\ANSYS HFSS）交流学习。
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DesignCon是全球性科技公司展示自己在高速信号设计与建模及仿真、测试测量、PCB加工、封装、材料、芯片、连接器等产品的年度盛会，分为Conference(研讨会)和Expo（展会）两部分。今年的展会于1.29~1.30在Santa Clara convention center举行，开放时间是12：00～18：00 ，参展商共有150余家，其中有主办方Agilent科技和Rambus，钻石赞助商Anritsu及Lecroy,白金赞助商ROHDE&SCHWARZ,金牌赞助商Sisoft及业界比较出名的一大堆公司，在此不一一例举；研讨会从1.28~31这几天举行，在这里可以目睹业内的牛人如Eric Bogatin、Herermann Eul、Istvan Novak、Istvan Novak、Mike Resso 、Alan Blankman及Heidi Barnes等等。
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1_TH6Paper_ComprehensiveFull_ChipMethodologytoVerifyElectromigration_v2.pdf
559.17 KB, 下载次数: 43
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1_TH6Slides_ComprehensiveFull_ChipMethodologytoVerifyElectromigration_v3.pdf
1.98 MB, 下载次数: 181
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1_WE1Paper_WorstCaseEyeEstimationMethod.pdf
1.83 MB, 下载次数: 92
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1_WE1Slides_WorstCaseEyeEstimationMethod.pdf
3.46 MB, 下载次数: 70
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1_WE2Paper_ImprovingCrosstalkAndVoltageNoise_v2.pdf
1.79 MB, 下载次数: 67
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1_WE2Slides_ImprovingCrosstalkAndVoltageNoise_v2.pdf
1.7 MB, 下载次数: 54
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1_WE3Paper_OptimizingOnDieDecap.pdf
1.13 MB, 下载次数: 41
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1_WE3Slides_OptimizingOnDieDecap_Final.pdf
1.87 MB, 下载次数: 43
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1_WE4Paper_ModelingMitigatingPowerSupplyNoiseNVIDIA_v2.pdf
1.12 MB, 下载次数: 33
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1_WE4Slides_ModelingandMitigatingPowerSupply.pdf
1.34 MB, 下载次数: 62
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1_WE5Paper_DistributedModelingandCharacterizationofOnChipSystem.pdf
3.69 MB, 下载次数: 85
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1_WE6Paper_AnalyzingOn_ChipSupplyNoise.pdf
1.27 MB, 下载次数: 49
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2_TU2Slides_ModelingPLLsForAMS_Wedge.pdf
1.63 MB, 下载次数: 59
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2_WE2Paper_ConvertingVerilogSystemCpp_v2.pdf
2.75 MB, 下载次数: 246
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2_WE4Paper_PracticalMethodForMeasuringDigital.pdf
2.91 MB, 下载次数: 41
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2_WE4Slides_PracticalMethodForMeasuringDigital.pdf
4.61 MB, 下载次数: 48
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3_TH2Paper_ModelingExtractionAndVerificationOfVCSELModelForOpticalIBISAMI_v2.pdf
846.76 KB, 下载次数: 18
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3_TH2Slides_ModelingExtractionAndVerificationOfVCSEL.pdf
3.84 MB, 下载次数: 37
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3_TH3Paper_LowJitterSBandOscillators_v3.pdf
687.96 KB, 下载次数: 9
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3_TH4Paper_MeasuredRandomJitter300GBitOptical_v2.pdf
758.38 KB, 下载次数: 19
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3_TH7Slides_OpticalSystemTechnologiesAndIntegration.pdf
3.13 MB, 下载次数: 33
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4_FR1Paper_LowCostDecouplingSolution_v2.pdf
1.67 MB, 下载次数: 129
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4_FR1Slides_LowCostDecouplingSolution.pdf
1.33 MB, 下载次数: 36
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4_FR2Paper_ANovelSchemetoImplement_v2.pdf
1.25 MB, 下载次数: 130
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4_TH2_Paper_PowerIntegrityAnalysisofChip.pdf
850.97 KB, 下载次数: 13
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4_TH2Slides_PowerIntegrityAnalysisofChip.pdf
2.32 MB, 下载次数: 133
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4_TH3Paper_ModelExtractionAndCircuitSimulationApproachesForSuccessfulSSOAnalysis.pdf
478.89 KB, 下载次数: 22
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4_TH3Slides_ModelExtractionAndCircuitSimulationApproachesForSuccessfulSSOAnalysis.pdf
1.39 MB, 下载次数: 154
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4_TH4Paper_Mixed_ReferenceforOptimumCost_v2.pdf
1.86 MB, 下载次数: 29
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4_TH4Slides_Mixed_ReferenceforOptimumCost_v3.pdf
1.86 MB, 下载次数: 137
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4_TU1Slides_HighDensityHighPerformancePackage_Swaminathan.pdf
3.65 MB, 下载次数: 27
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4_TUSlides_High_Density_High_Performance_Package_FRANZON.pdf
2.17 MB, 下载次数: 136
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5_TH2Paper_NewMethodologyFor25_Gbps.pdf
2.34 MB, 下载次数: 30
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5_TH2Slides_Newmethodologyfor25_Gbps.pdf
1.93 MB, 下载次数: 156
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5_TH3Slides_EFFECTIVE_CONDUCTIVITYCONCEPTFORMODELLING.pdf
3.18 MB, 下载次数: 28
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5_TH4Paper_Reducing_Signal_Transmission_Loss_by_Low_Surface_Roughness.pdf
1.34 MB, 下载次数: 36
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5_TH4Slides_ReducingSignalTransmissionLoss.pdf
3.14 MB, 下载次数: 28
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5_TU2Slides_PracticalMeasurementsofDielectrics_v2.pdf
1.74 MB, 下载次数: 141
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5_WE5Slides_HaveYourCakeAndEat.pdf
3.67 MB, 下载次数: 28
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5_WE6Paper_CircuitBoardMaterialPropertiesConsiderations.pdf
864.25 KB, 下载次数: 22
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6_TU1Slides_RoutingDiffSignalsDesigCon_06.pdf
1.92 MB, 下载次数: 21
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6_WE2Paper_ModelbasedPreciseLinkBudget.pdf
1.66 MB, 下载次数: 42
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6_WE3Paper_PracticalDesignConsiderationsforDenseHighSpeed.pdf
2.53 MB, 下载次数: 13
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6_WE3Slides_PracticalDesignConsiderationsforDenseHighSpeed.pdf
4.8 MB, 下载次数: 228
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6_WE4Paper_Package_PCB_Interface_Discontinuity_Optimization_Final.pdf
3.72 MB, 下载次数: 29
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6_WE4Slides_Package_PCBInterfaceDiscontinuityOptimization_Final.pdf
2.9 MB, 下载次数: 239
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6_WE7Slides_HowPCBDesignisChanging.pdf
3.98 MB, 下载次数: 25
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7_TH5Paper_DecouplingCapacitorOptimizationbySpectral_v2.pdf
1.25 MB, 下载次数: 113
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7_TH5Slides_DecouplingCapacitorOptimizationbySpectral.pdf
2.09 MB, 下载次数: 19
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7_TH6Paper_3DStackedSignaling.pdf
943.91 KB, 下载次数: 12
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7_TH6Slides_3DStackedSignaling.pdf
1.11 MB, 下载次数: 20
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7_WE3Paper_VersatileIOCircuitSchemesforLPDDR4.pdf
730.82 KB, 下载次数: 7
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7_WE3Slides_VersatileIOCircuitSchemesforLPDDR4.pdf
2.52 MB, 下载次数: 17
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7_WE4Paper_OptimizingDDR4_PHYDesigntoReduce_v3.pdf
1005.52 KB, 下载次数: 9
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7_WE4Slides_OptimizingDDR4PHYDesigntoReduce.pdf
1.21 MB, 下载次数: 14
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7_WE6Paper_TheRoadto1TBpsBandwidth.pdf
989.5 KB, 下载次数: 13
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7_WE6Slides_Theroadto1TBps_v3.pdf
1.79 MB, 下载次数: 25
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8_FR1Paper_MovingHigherDataRateSerial.pdf
1.25 MB, 下载次数: 129
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8_FR1Slides_MovingHigherDataRateSerial.pdf
2.41 MB, 下载次数: 5
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8_FR2Slides_HowDOEsavedVSR_v2.pdf
1.41 MB, 下载次数: 21
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8_FR3Paper_IntraPairUnaccountedSkewEffects.pdf
2.4 MB, 下载次数: 21
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8_FR3Slides_IntraPairUnaccountedSkewEffects.pdf
2.29 MB, 下载次数: 114
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8_TH1Paper_ImprovedStatisticalLinkPathAnalysis.pdf
1.54 MB, 下载次数: 20
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8_TH1Slides_ImprovedStatisticalLinkPathAnalysis.pdf
2.2 MB, 下载次数: 18
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8_TH2Paper_MethodForAnalyticallyCalculatingBER.pdf
1.23 MB, 下载次数: 21
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8_TH2Slides_MethodForAnalyticallyCalculatingBER.pdf
1.65 MB, 下载次数: 26
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8_TH3Paper_OvercomingtheSIChallengesin.pdf
1.84 MB, 下载次数: 21
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8_TH4Paper_HighSpeedSerialLinkSimulationBasedonDynamicModeling.pdf
737.86 KB, 下载次数: 16
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8_TH4Slides_HighSpeedSerialLinkSimulationBasedonDynamicModeling.pdf
1.37 MB, 下载次数: 24
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8_TH6Paper_StateOfIEEE802.3bj100G.pdf
633.93 KB, 下载次数: 14
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8_TH7Slides_Post_EqualizationMetricsAT_25Gbps_v2.pdf
2.33 MB, 下载次数: 20
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8_TU2Slides_RelatingCOMtoFamiliarS_ParameterParametrictoAssist25GbpsSystemDesign.pdf
2.04 MB, 下载次数: 37
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8_WE5Paper_IBISAMIModelingofRetimer.pdf
1.76 MB, 下载次数: 16
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8_WE5Slides_IBISAMIModelingofRetimer.pdf
2.37 MB, 下载次数: 139
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8_WE6Paper_ImprovingIBISAMIModelAccuracy.pdf
3.22 MB, 下载次数: 17
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9_WE1_Paper_10.3Gbps_Link_Optimization_and_its_Impact_on_Jitter_Rev2.pdf
1.08 MB, 下载次数: 106
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9_WE1_Slides_10_3Gbps_Link_Optimization_and_its_Impact_on_Jitter_Rev2.pdf
3.39 MB, 下载次数: 14
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9_WE2Paper_TheJitterNoiseDuality.pdf
3.67 MB, 下载次数: 217
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9_WE2Slides_TheJitterNoiseDuality.pdf
2.64 MB, 下载次数: 10
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9_WE4Paper_MechanismJitterAmplificationClockChannel.pdf
643.51 KB, 下载次数: 8
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9_WE4Slides_MechanismJitterAmplificationClockChannel.pdf
859.29 KB, 下载次数: 13
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9_WE5_MethodologiesforStressedReceiverTesting.pdf
1.8 MB, 下载次数: 120
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9_WE5_MethodologiesforStressedReceiverTesting_Paper.pdf
1.5 MB, 下载次数: 14
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10_TH1Paper_HighSpeedLinkSimulationStrategy.pdf
2.44 MB, 下载次数: 201
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10_TH1Slides_HighSpeedLinkSimulationStrategy.pdf
3.29 MB, 下载次数: 13
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10_TH2Paper_PartialResponseMaximumLikelihoodEqualization.pdf
1.42 MB, 下载次数: 16
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10_TH2Slides_PartialResponseMaximumLikelihoodEqualization_final.pdf
1.55 MB, 下载次数: 11
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10_TH3Paper_111.18GbitsGFECDesign.pdf
1.56 MB, 下载次数: 134
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10_TH4Paper_EfficientCircuit_LevelImplementationOf.pdf
2.71 MB, 下载次数: 13
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10_TH5Paper_ModulationEqualizationandForwardError.pdf
1.11 MB, 下载次数: 142
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10_TH6Paper_StrategiesforDeterminingtheOptimal.pdf
1.59 MB, 下载次数: 14
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10_TH6Slides_StrategiesforDeterminingtheOptimal.pdf
2.43 MB, 下载次数: 18
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11_WE1Paper_SoCPowerIntegrity_from_Early.pdf
1.11 MB, 下载次数: 12
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11_WE1Slides_SoCPowerIntegrityFromEarlyEstimation.pdf
2.34 MB, 下载次数: 19
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11_WE2Paper_PowerManagementNetworkDesignMethodology.pdf
521.72 KB, 下载次数: 11
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11_WE2Slides_PowerManagementNetworkDesignMethodology.pdf
956.83 KB, 下载次数: 14
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11_WE3Paper_AnalysisandCorrelationsofSukpply.pdf
1.73 MB, 下载次数: 17
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11_WE3Slides_AnalysisandCorrelationsofSupply.pdf
1.73 MB, 下载次数: 101
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11_WE4Paper_Top_DownDesignMethodologyforEnhanced_v4.pdf
1.06 MB, 下载次数: 15
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11_WE4Slides_Top_DownDesignMethodologyforEnhanced.pdf
1.54 MB, 下载次数: 17
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11_WE5Slides_Touchstonev2SIPISParameterModels.pdf
4.15 MB, 下载次数: 22
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11_WE7Paper_SystemLevelPowerIntegrityTools.pdf
1.15 MB, 下载次数: 17
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12_TH2Paper_TroubleshootingRadiatedEmissionsToolkit_v2.pdf
4.87 MB, 下载次数: 13
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12_TH3Paper_QuantitativeEMIanalysis.pdf
1.53 MB, 下载次数: 29
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12_TH4Paper_OnchipAwarePackageandBoard.pdf
703.56 KB, 下载次数: 11
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12_TH4Slides_OnchipAwarePackageandBoard.pdf
2.02 MB, 下载次数: 28
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12_TH5Paper_Chip_Package_System_ESD_Simulation.pdf
2.67 MB, 下载次数: 16
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13_FR2Paper_Higher_Speed_Ethernet40Gb.pdf
1.01 MB, 下载次数: 31
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13_FR3Paper_DeMystifyingthe28gbsPCBChannel_v2.pdf
2.93 MB, 下载次数: 8
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13_TH2Paper_RealTimeJitterMeasurement.pdf
571.4 KB, 下载次数: 16
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13_TH2Paper_RealTimeJItterMesurement_v2.pdf
604.85 KB, 下载次数: 10
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13_TH2Slides_RealTimeJitterMeasurement.pdf
1.28 MB, 下载次数: 22
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13_TH3Paper_CorrelationOfMeasurementAndSimulation_v2.pdf
2.21 MB, 下载次数: 55
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13_TH3Slides_CorrelationOfMeasurementAndSimulation.pdf
2.08 MB, 下载次数: 37
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13_TH4Paper_ManagingS_parameters.pdf
1.61 MB, 下载次数: 27
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13_TH4Slides_ManagingS_parameterData.pdf
2.32 MB, 下载次数: 59
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13_TH5Paper_CrackingTheCode.pdf
2.68 MB, 下载次数: 36
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13_TH5Slides_CrackingTheCode_final.pdf
3.77 MB, 下载次数: 214
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13_TH6Paper_RX_JitterJitterMeasurementand.pdf
1.77 MB, 下载次数: 60
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13_TH7_Slides_Panel_Closing_the_loop_when_measurement_simulation.pdf
2.99 MB, 下载次数: 40
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13_TU2Slides_TipsonImprovingTestTime_v2.pdf
2.6 MB, 下载次数: 29
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13_WE5Paper_PracticalTechniquesAndTipsFor.pdf
2.28 MB, 下载次数: 149
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13_WE5Slides_PracticalTechniquesAndTipsFor.pdf
3.37 MB, 下载次数: 30
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13_WE6Paper_StrengthsandWeaknessesofVarious.pdf
1.96 MB, 下载次数: 28
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13_WE6Slides_StrengthsAndWeaknessesOfVarious.pdf
4.57 MB, 下载次数: 56
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14_TH1Paper_EliminationOfConductorFoilRoughness.pdf
1.8 MB, 下载次数: 144
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14_TH1Slides_EliminationofConductorFoilRoughnessEffects_v3.pdf
2.69 MB, 下载次数: 43
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14_TU2Slides_AccurateModelingofElectronicPackageDesigns.pdf
3.96 MB, 下载次数: 142
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14_WE1Paper_SourcesAndCompensationOfSkew.pdf
2.22 MB, 下载次数: 65
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14_WE2Paper_LessonLearnedHowToMake_v3.pdf
3.34 MB, 下载次数: 27
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14_WE2Slides_LessonsLearnedHowToMake.pdf
2.58 MB, 下载次数: 48
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14_WE3Paper_ALoewnerMatrixBasedAlgorithm.pdf
119.57 KB, 下载次数: 12
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14_WE3Slides_ALoewnerMatrixBasedAlgorithm.pdf
1.19 MB, 下载次数: 43
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14_WE4Paper_ComputationOfTDRImpedanceFromSParameters.pdf
1.79 MB, 下载次数: 140
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CT_07Slides_SIandEMIareRelated.pdf
1.89 MB, 下载次数: 26
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CT08slides_Signal_Integrity_Analysis_of_DDR3.pdf
1.7 MB, 下载次数: 21
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DesignCon_pawlowski_keynote_16_9_final.pdf
1.55 MB, 下载次数: 39
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Hermann_Keynote_FINAL_V_21.pdf
2.22 MB, 下载次数: 18
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|Archiver|手机版|小黑屋|TechAIRD（gaosupcb Inc.）
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发表于 2014-2-22 16:00:33
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发表于 2014-2-22 16:13:59
发表于 2014-2-23 01:01:48